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      The Ultra-Fast UFS Advantage

      UFS is a high-performance storage interface ideal for computing and mobile systems that require low power consumption and for advanced automotive systems that need ultra-fast boot capability and automotive-grade reliability. We’re using the UFS 2.1 standard in our UFS devices to enable your ultra-fast user experiences.

      Build in our UFS products and get:

      • Significantly faster random read speeds than with the e.MMC 5.1 interface.
      • Industry-leading sequential read performance (600 MB/s of max I/F bandwidth) with the High-Speed Gear 3 specification. 
      • More efficient multitasking and data ordering thanks to UFS 2.1’s Command Queue technology,  which enables read and write commands simultaneously, different from e.MMC interfaces.

      UFS 2.1 Serial Interface

       

      e.MMC 5.1 Parallel Interface

      Density

      Select Density
      • 32GB
      • 64GB
      • 128GB
      • 256GB
      Range: 32GB - 256GB
      • Voltage
        3.3V
      • Package
        TFBGA
      • Protocol
        UFS 2.1
      • Op. Temp.
        -45C to +95C, -45C to +105C
      • Voltage
        3.3V
      • Package
        TFBGA
      • Protocol
        UFS 2.1
      • Op. Temp.
        -45C to +95C, -45C to +105C
      • Voltage
        3.3V
      • Package
        TFBGA
      • Protocol
        UFS 2.1
      • Op. Temp.
        -45C to +95C, -45C to +105C
      • Voltage
        3.3V
      • Package
        TFBGA
      • Protocol
        UFS 2.1
      • Op. Temp.
        -45C to +95C, -45C to +105C

      Benefits for Automotive

      UFS enhances in-vehicle infotainment systems and instrument clusters in connected vehicles with its many benefits like these:

       

      • Superior Performance: Enables up to 941 MB/s reads and 651 MB/s writes, which means almost 3X faster reads and more than 2X faster writes than e.MMC interfaces.
      • Expanded Temps: Supports Automotive Electronics Council (AEC)-Q100 Grade 3 (40°C to 105°C) and AEC-Q100 Grade 2 (40 to 95°C) temperature requirements.
      • High Quality and Reliability: Complies with AEC-Q100 and Internal Automotive Task Force 16949 standards.
      • Cost-Effectiveness: Takes advantage of industry-leading 64-layer triple-level-cell 3D NAND with CMOS under array technology. 

      Benefits for Mobile

      UFS is the ideal interface for next-gen mobile devices, and here’s why:

      • Performance: Enables much quicker load times for applications and files as well as faster device boot-up compared to e.MMC 5.1.
      • Multi-Tasking Responsiveness: Provides a seamless experience when switching between multiple applications due to lower UFS latencies. 
      • Camera Performance: Enables a significant increase in performance over e.MMC 5.1 when shooting bursts of photos or multiple photo stitches like panoramas due to higher memory interface bandwidth.
      • Richer Content: Enables seamless HD streaming and more graphically rich content (like in gaming) thanks to the faster read/write performance with UFS.

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