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      Multichip Packages

      Get the critical features and functions for your design—including high performance, high quality, power efficiency, wide density ranges, small package sizes, and industrial temperature ranges—from our broad portfolio of industry-standard multichip packages (MCPs).

      View Part Catalogs
      Product Family
      Advanced Solutions
      DRAM
      DRAM Modules
      Graphics Memory
      Managed NAND
      Memory Cards
      Multichip Packages
      NAND Flash
      NOR Flash
      Solid State Drives
      Product Technology
      1100
      1300
      2200
      3D NAND Flash
      5100
      5200
      5210
      9200
      9300
      Authenta
      Client SSD
      DDR SDRAM
      DDR2 SDRAM
      DDR3 SDRAM
      DDR4 SDRAM
      e.MMC
      e.MMC-Based MCP
      Enterprise MLC
      Enterprise SSD
      FortisFlash
      GDDR5
      GDDR5X
      GDDR6
      Industrial microSD Cards
      Industrial SSD
      Legacy NOR Flash
      LPDRAM
      LRDIMM
      Mini-DIMM
      MLC NAND Flash
      MT25Q
      NAND-Based MCP
      NOR Flash for Automotive
      NOR-Based MCP
      NVMe SSD
      RLDRAM
      SATA SSDs
      SDRAM
      Secure NOR Flash
      Serial NAND Flash
      Serial NOR Flash
      SLC NAND Flash
      Solid State Drives
      TLC NAND Flash
      Twin-Quad NOR Flash
      Universal Flash Storage
      VLP Mini-DIMM
      Wafer Level CSP and KGD NOR Flash
      Xccela Flash
      View Part Catalog

      By Family

      e.MMC-Based MCP
      Quick look
      Benefits
      • Embedded managed NAND and High Performance LPDRAM in a single package
      • Simplified software solutions for complex high density NAND applications
      • Technology
        e.MMC, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
      • Densities
        e.MMC: 4GB–32GB; LPDRAM: 4Gb–48Gb
      • Package
        WFBGA, VFBGA, TFBGA, POP
      UFS-Based MCP (uMCP)
      Quick look
      Benefits
      • Embedded managed NAND and high-performance LPDRAM in a single package.
      • Enables high-density, low-power storage in a small footprint.
      • Technology
        LPDDR4 SDRAM, LPDDR4X SDRAM, UFS 3D NAND
      • Densities
        UFS: 32GB; LPDRAM: 24Gb (3GB)
      • Package
        WFBGA
      NAND-Based MCP
      Quick look
      Benefits
      • Offers high densities for data-intensive applications
      • Provides high speeds, with x8, x16 and x32 bus widths
      • Enables high reliability with SLC NAND that provides up to 100,000 PROGRAM/ERASE cycles
      • Technology
        LPDDR SDRAM, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
      • Densities
        NAND: 1Gb - 8Gb
      • Package
        WFBGA, VFBGA, TFBGA, POP
      NOR-Based MCP
      Quick look
      Benefits

      • Simplifies design while speeding performance for low-density applications
      • Reduces active ball count by more than 50% thanks to shared-bus and A/D MUX options
      • Speeds boot-up and extends battery life with execute-in-place (XIP) functionality
      • Supports low-voltage applications (1.8V)
      • NOR Densities
        64Mb - 128Mb
      • Voltage
        1.8V
      • Package
        TFBGA, VFBGA

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